The Cooler Master CryoNamics 4 x 3 x 0.2 High Performance Thermal Pad [TPY-ADPG-3040-R1] represents a breakthrough advancement in solid-state thermal interface design, shifting away from traditional application methods to maximize heat transfer across high-power computer components. Engineered with advanced material physics, this pad provides an extremely clean and highly reliable thermal link between processing units and heatsinks.
This high-performance thermal pad utilizes a specialised phase change material that remains structurally solid at room temperature for precise positioning and easy installation, but transitions to a highly compliant, paste-like state once operational thresholds are reached. This phase-shifting behaviour allows the compound to thoroughly moisten contact surfaces, displace microscopic air pockets, and lower overall thermal impedance to deliver superior heat dissipation across critical electronics.
Key Features & Specifications
Phase Change Technology: Implements a premium phase change material that alters its physical state under operational heat to perfectly contour to surfaces, optimizing thermal transfer.
Silicon-Free Formulation: Developed entirely without silicone ingredients to guarantee zero oil bleeding, compound evaporation, or material degradation over extended system usage.
Electrical Non-Conductivity: Engineered as a high-dielectric component that remains completely non-conductive, eliminating risks of short-circuiting sensitive surface-mounted components.
Optimized Physical Dimensions: Features precise dimensions of 40mm x 30mm with an ultra-thin 0.2mm profile, designed to match modern processing architectures and ensure high-density conduction.
The Computer Guy Charmhaven Advantage
In-Store Advice: Our technical specialists can guide you through selecting the ideal phase-change pad dimensions and detail the exact surface preparation required to optimize your cooling efficiency.
Local Support & Advice: Drop into our Charmhaven facility for professional assistance on safe component disassembly, old interface removal, and proper alignment of your performance thermal pads.
$12.00
In stock
%20Specs.webp)
| Weight | .05 kg |
|---|---|
| Dimensions | 9 × 2 × 12 cm |
Important Product Information
Compatibility: Universally suitable for various technical heat transfer platforms including desktop CPUs, dedicated graphics processors (GPUs), video game consoles, RAM matrices, and laptop cooling assemblies.
Local Support: Our team provides direct support to help you achieve proper mounting pressure and ideal spatial alignment, ensuring the phase-change material performs exactly to factory specification.
Specifications Table
| Feature | Specification |
| Model Number | TPY-ADPG-3040-R1 |
| Thermal Conductivity (W/mK) | High-efficiency phase-change rating (0.07 °C·in²/W thermal impedance) |
| Electrical Conductivity | Non-conductive |
| Viscosity | Solid-state pad at room temp; shifts to low-impedance conforming state under load |
| Operating Temperature Range | -40°C to 125°C |
| Tube Size / Quantity | 1 Piece (40 x 30 x 0.2 mm) |
| Paste Type | Phase Change Material (PCM), Silicon-Free |
| Durability / Lifespan | High reliability, non-drying, non-cracking solid integration |
| Application Method | Pre-cut solid pad for direct surface placement |
| Included Accessories | Grease cleaner wipe |
