Description:
The Iceberg FUZEIce Plus 13 W/mK thermal paste features high thermal conductivity, moderate density, and high viscosity. It is non-electrically conductive and comes in a 3.5 gram net weight, designed for long-lasting performance
| Specification |
Value |
| Thermal Conductivity |
13 W/mK |
| Density |
2.6 g/cm³ |
| Viscosity |
60,000 poise |
| Net Weight |
3.5 g (0.13 oz) |
| Volume Resistivity |
1.8 × 10¹² Ω |
| Operating Temperature |
−50°C to 200°C |
| Storage Temperature |
5°C to 25°C |
| Features |
Non-electrically conductive; Includes 2-in-1 applicator and angled spreader; Designed for long-lasting performance |
- [High thermal conductivity]: composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
- [Safe application]: This is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
- [High durability]: in contrast to metal and silicon thermal compound, This does not compromise over time. Once applied, you do not need to apply it again as it will last at least for a few years.
- [Easy to apply]: with an ideal consistency, This is very easy to use, even for beginners.
- [Thermal compound]: formula, this guarantees exceptional heat dissipation from the components and supports the stability needed to push your system to its limit.
