Description
%20Spec.webp)
The Arctic MX-4 Thermal Compound 4 Gram [MX-4 4 Gram Rev.3] is a premium-grade thermal interface material engineered to deliver exceptional heat transfer for high-performance computing components. Packaged in a convenient, resealable syringe, this 4-gram variant provides ample compound for multiple installations, ensuring optimal contact between your processing units and their respective cooling solutions.
Formulated with carbon microparticles, this high-performance paste boasts an impressive thermal conductivity of 8.5 W/mK to efficiently bridge microscopic surface imperfections on processors and heatsink baselines. The non-curing, non-bleeding mixture ensures maximum electrical safety with its metal-free, non-conductive composition, completely eliminating the risks of short circuits during application on sensitive electronic circuitry.
Key Features & Specifications
Thermal conductivity: Features a high rating of 8.5 W/mK to guarantee rapid thermal transfer away from hot silicon cores.
Electrical conductivity: Completely non-conductive and metal-free formula prevents any risk of electrical short-circuits.
Viscosity/application ease: Optimized consistency of 870 to 31,600 poise allows for smooth, uniform spreading across various application patterns.
Tube size / quantity: Supplied in a precise 4-gram syringe format, perfect for multiple individual hardware installations.
The Computer Guy Charmhaven Advantage
In-Store Advice: Tailored technical recommendations on selecting the absolute best thermal compound for your specific CPU or GPU setup, ensuring ideal consistency and thermal properties.
Local Support & Advice: Comprehensive, hands-on guidance from our Charmhaven workshop to assist you in choosing application patterns or proper mounting pressure during your custom PC builds.
$15.00
In stock
%20Spec.webp)
| Weight | .02 kg |
|---|---|
| Dimensions | 19 × 9 × 2 cm |
Important Product Information
Universal hardware compatibility delivers top-tier performance on multi-core desktop processors, extreme graphics chips, demanding gaming laptops, and current-generation gaming consoles.
Accessible local technical backing ensures system builders maintain proper application depth and avoid performance-limiting air voids during hardware cooler seating.
Specifications Table
| Feature | Specification |
| Model Number | TG-KE-002-R |
| Thermal Conductivity (W/mK) | 14.2 W/mK |
| Electrical Conductivity | Non-conductive, non-capacitive |
| Viscosity | 130 – 180 Pas |
| Operating Temperature Range | -250°C to 350°C |
| Tube Size / Quantity | 2 Grams |
| Paste Type | Silicone-based with nano aluminum/zinc oxide particles |
| Durability / Lifespan | Non-curing, long-term performance stability |
| Application Method | Syringe with precision applicator tips |
| Included Accessories | Two applicator spatulas, resealable storage bag |