Description
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The Arctic Silver Ceramique 2 Thermal Compound 2.7 Gram [AS-C2-27G] is a premium, high-density thermal interface material engineered to deliver exceptional heat transfer for modern electronic components. Designed as an evolution of advanced cooling technologies, it features a unique tri-linear blend of sub-micron ceramic fillers including aluminum oxide, zinc oxide, and boron nitride. This combination allows for an incredibly thin bond line between high-performance processors and heatsinks, facilitating rapid heat dissipation and significantly lowering operating temperatures under heavy system loads
Utilizing a third-generation polysynthetic suspension fluid mixed with advanced synthetic oils, this thermal paste ensures enhanced particle deagglomeration, dispersal, and density. This specialized formula guarantees excellent stability, preventing the compound from separating, running, migrating, or bleeding away from the application site over prolonged use. Because it contains absolutely no metal or electrical pathways, it acts as a pure electrical insulator and is completely non-capacitive, eliminating any risk of short circuits or hardware damage during application
Tri-Linear Ceramic Content: Formulated exclusively with ceramic fillers including aluminum oxide, zinc oxide, and boron nitride to maximize heat transfer while maintaining safety.
Pure Electrical Insulator: Contains no metallic or conductive ingredients, ensuring the paste is neither electrically conductive nor capacitive for complete safety around sensitive components.
Advanced Polysynthetic Fluid: A third-generation oil mixture provides superior stability, engineered to resist running, migration, separation, or bleeding.
Innovative Syringe Dispenser: Packaged in a convenient 2.7-gram tube where the rear of the plunger aligns perfectly flush with the flange when empty, making it simple to determine the remaining volume
Exceptional Temperature Performance: Offers high structural stability across a massive operational envelope, achieving a 2 to 10 degrees Celsius drop in CPU core temperatures compared to standard generic pads or stock thermal pastes
In-Store Advice: Receive expert, tailor-made recommendations on matching the ideal thermal interface material to your specific processing hardware and system configurations.
Local Support & Advice: Benefit from professional local guidance right here in Charmhaven to assist with hands-on hardware positioning, surface cleaning methods, and optimal mounting pressure techniques.
$9.00
In stock
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| Weight | .02 kg |
|---|---|
| Dimensions | 14 × 3 × 2 cm |
Compatibility: Universally compatible with an array of heat-generating components including desktop CPUs, dedicated graphics processors (GPUs), game consoles, laptop chipsets, and high-power LED arrays.
Local Support: Access structured local insights explaining the critical 25-hour break-in period and thermal cycling routine required to reach maximum particle-to-particle thermal conductivity.
| Feature | Specification |
|---|---|
| Model Number | AS-C2-27G / CMQ2-2.7G |
| Thermal Conductivity (W/mK) | High-Density Ceramic Standard |
| Electrical Conductivity | Non-conductive / Non-capacitive |
| Viscosity | High-density paste |
| Operating Temperature Range | Peak: -150°C to >185°C / Long-Term: -150°C to 130°C |
| Tube Size / Quantity | 2.7 Grams (approx. 1cc) |
| Paste Type | Ceramic-based (Tri-linear composite) |
| Durability / Lifespan | High-stability non-curing formula |
| Application Method | Manual syringe application |
| Included Accessories | Easy-dispense syringe plunger system |