BSFF BS-139 High Performance Thermal Paste (11 Gram)
BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently.
HIGH DURABILITY: BSFF thermal paste Edition formula has excellent component heat dissipation performance and has the stability to push the system to the limit.
EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years.
EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners
Key Specifications
Composition: Carbon microparticles
Safety: Metal-free and non-conductive, protecting against short circuits
Durability: Stable formula that does not compromise over time, lasting at least 5 years
Performance: High thermal conductivity for efficient heat dissipation from CPUs and GPUs
Application: Ideal consistency for easy application, even for beginners
