Description
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The BSFF BS-139 High Performance Thermal Paste 11 Gram [X0012B9629] delivers an exceptional thermal interface solution engineered to facilitate rapid heat transfers between high-wattage processors and cooling heatsinks. Formulated using specialized carbon microparticles, this high-density compound achieves superior thermal coupling without relying on electrically conductive metal elements, making it an excellent upgrade for long-term hardware reliability.
This premium carbon-based compound exhibits high structural stability under extreme thermal cycling, completely resisting regular drying, bleeding, or the fluid migration typical of standard silicon-based grease. Its carefully balanced viscosity provides an effortless, smooth spread that naturally optimizes the bond line thickness under standard hardware mounting pressure, maximizing heat dissipation immediately upon assembly.
Key Features & Specifications
Thermal conductivity: Features an advanced 13.9 W/mK rating that ensures exceptionally rapid heat transfers for high-performance desktop CPUs, graphics card cores, and overclocked configurations.
Electrical conductivity: Specially engineered as a completely metal-free and non-conductive compound, entirely eliminating the risk of electronic short circuits or static capacitance issues on open circuitry.
Viscosity/application ease: Balanced with a precise microparticle consistency that allows for smooth, even distribution across a processor die without running, separation, or structural breakdown.
Longevity/durability: Formulated with a high-durability compound matrix that maintains full heat-transfer consistency for a minimum of 5 years without requiring regular reapplication or deep maintenance.
The Computer Guy Charmhaven Advantage
In-Store Advice: Our local technical professionals provide direct assistance on selecting appropriate compound volumes and demonstrating proper cross, dot, or spread application methods for current multi-die architectures.
Local Support & Advice: Access dedicated hands-on guidance right here in Charmhaven to assist you with proper heat spreader cleaning, surface preparation, and correct paste application during your hardware upgrades.
$25.00
In stock
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| Weight | .03 kg |
|---|---|
| Dimensions | 20 × 3 × 2 cm |
Important Product Information
High operational compatibility spans seamlessly across mainstream Intel and AMD desktop processors, high-draw dedicated graphics GPUs, performance laptops, and modern home gaming consoles.
Local technical support offers personalized instructions detailing correct application layer thickness to avoid component edge run-off while maintaining optimal cooler contact.
Specifications Table
| Feature | Specification |
| Model Number | BS-139 / X0012B9629 |
| Thermal Conductivity (W/mK) | 13.9 W/mK |
| Electrical Conductivity | Non-Conductive / Non-Capacitive |
| Viscosity | Premium Microparticle Density |
| Operating Temperature Range | High-Stability Thermal Range |
| Tube Size / Quantity | 11 Grams |
| Paste Type | Carbon-based |
| Durability / Lifespan | Minimum 5-year lifespan formula |
| Application Method | Syringe dispenser with included toolkit |
| Included Accessories | Multi-piece application toolkit (palette, spreading card, cleaning wipes) |