Iceberg FUZEIce Plus 13 W/mK Thermal Paste 3.5 Gram (B092LVCH2J)

The Iceberg FUZEIce Plus 13 W/mK Thermal Paste 3.5 Gram [B092LVCH2J] establishes a high-performance thermal junction between computer processors and demanding refrigeration units. Developed to facilitate rapid thermal dissipation for high-draw hardware configurations, this premium grease eliminates the micro-scale air boundaries between contact surfaces to ensure uninterrupted, immediate energy conduction upon installation.

This advanced thermal compound utilizes specialized micro-particles that optimize surface compliance and structural persistence across intensive thermal cycles. Its stable composition resists early hardening, separation, and the pump-out effect under fluctuating computing temperatures, allowing system builders to maintain highly effective, predictable component operations without needing frequent thermal re-servicing.

Key Features & Specifications

• Thermal conductivity: Features an exceptional 13 W/mK rating to deliver rapid, heavy-duty heat dissipation for overclocked desktop CPUs and performance graphics architectures.

• Electrical conductivity: Formulated with high dielectric materials to remain completely non-conductive and non-capacitive, removing any risk of short circuits across nearby board traces.

• Viscosity/application ease: Engineered with a specialized, balanced consistency that enables an even and smooth spread from the syringe dispenser to secure an ideal low bond line thickness.

• Operating temperature range: Maintains chemical integrity and stable physical composition across a wide operational temperature spectrum spanning from -50°C to 200°C.

The Computer Guy Charmhaven Advantage

• In-Store Advice: Our local technical professionals provide direct advice on selecting premium high-conductivity compounds and demonstrating correct application patterns for multi-die setups.

• Local Support & Advice: Access dedicated hands-on guidance right here in Charmhaven to assist you with total legacy compound extraction, thorough surface preparation, and precise paste distribution.