Description
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The Thermal Grizzly Minus Pad Advance 120 x 20 x 2mm [TG-MP-A-120-20-20-4] delivers a premium, highly compressible thermal interface solution designed to bridge substantial physical clearances between structural board components and primary cooling assemblies. Engineered as a significant evolutionary leap within specialized gap-filler technologies, this professional-grade interface pad ensures an optimal, high-efficiency heat transfer pathway from the moment hardware installation pressure is applied.
Formulated with an advanced aluminum oxide and silicone composite matrix, this high-performance cooling pad achieves remarkable surface conformity under exceptionally low mounting tension. Its specialized physical structure allows it to mold flawlessly around irregular component profiles, making it a highly reliable boundary option that completely eliminates air gaps while resisting physical drying, structural compression breakdown, or fluid oil migration during continuous, intensive system operation.
Key Features & Specifications
Thermal conductivity: Formulated with advanced conductive micro-fillers to deliver significantly enhanced, heavy-duty cooling efficiency compared to standard baseline thermal interface materials.
Electrical conductivity: Engineered to be strictly non-conductive and anti-static, eliminating any threat of electronic short circuits or component board damage when laid directly over open circuit tracks.
Viscosity/application ease: Features a highly flexible, elastic, and high-compressibility solid structural design that is remarkably easy to handle and cut cleanly into custom sheet layouts or custom component dimensions.
Tube size / quantity: Supplied as a convenient, professional 4-pack array consisting of four individual pre-formed pads measuring 120 mm x 20 mm with a specialized 2.0mm thickness to accommodate deeper clearances.
The Computer Guy Charmhaven Advantage
In-Store Advice: Our local technical professionals provide direct assistance on evaluating structural gap clearances and determining whether high-compressibility pads or standard liquid thermal pastes fit your thermal solution design.
Local Support & Advice: Access dedicated hands-on technical guidance right here in Charmhaven to assist you with proper layer measurements, accurate cleanings, and perfect manual pad custom cuts during a full system upgrade.
$29.00
In stock
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| Weight | .02 kg |
|---|---|
| Dimensions | 18 × 10 × 1 cm |
Important Product Information
Compatibility: Universally compatible across high-draw desktop graphics card VRAM/VRM cooling plates, solid-state drive (SSD) M.2 heatsinks, performance gaming laptops, and major home gaming console boards.
Local support: Our local store team delivers focused placement guidance, instructing you on proper surface preparation and appropriate alignment pressure to eliminate insulation pockets while maintaining clean perimeters.
Specifications Table
| Feature | Specification |
| Model Number | TG-MP-A-120-20-20-4 |
| Thermal Conductivity (W/mK) | Premium High-Performance Advance Rating |
| Electrical Conductivity | Non-Conductive / High Dielectric Insulation |
| Viscosity | Pliable Solid Sheet (High Compressibility Profile) |
| Operating Temperature Range | High-Stability Temperature Profile |
| Tube Size / Quantity | 4 Pieces (120 mm × 20 mm × 2.0 mm per pad) |
| Paste Type | Aluminum oxide / Silicone complex thermal pad |
| Durability / Lifespan | Non-drying, bleed-resistant formula with stable compression |
| Application Method | Pre-formed pad (Cut-to-size sheet layout) |
| Included Accessories | 4x Minus Pad Advance sheets |