Description

Description:
Thermalright TF4 thermal paste is a non-conductive, high-performance thermal interface material with a thermal conductivity of 9.5 W/m·K.
It is designed for cooling computer components like CPUs and GPUs, offering a balance of performance and longevity.
The paste is safe to use due to being non-conductive and non-corrosive, and it can operate in temperatures from −50°C to +240°C.
The 1.5 g quantity is suitable for several applications, as only a small amount is needed for each use.
The paste fills microscopic gaps between a CPU/GPU and its heat sink, creating a more efficient path for heat transfer.
| Feature | Details |
|---|---|
| Product Name | Thermalright TF4 Thermal Paste |
| Thermal Conductivity | 9.5 W/m·K |
| Thermal Resistance | <0.0068 |
| Operating Temperature | −50°C to +240°C |
| Color | Grey |
| Specific Gravity | 2.7 (at 25°C) |
| Electrical Conductivity | Non-conductive |
| Safety | Non-corrosive and harmless |
| Durability | Long-lasting, low volatility |
| Ease of Use | Easy to apply, needle-type tube |
| Quantity | 1.5 g (suitable for multiple applications) |
$9.00
Out of stock
