Description
%20Specs.webp)
The BSFF BS-139 High Performance Thermal Paste 3.5 Gram [X0012AB81P] provides an exceptional thermal interface engineered to sustain premium heat transfer rates across high-demand desktop processors and graphics hardware. Formulated with densely concentrated carbon microparticles, this specialized grease rapidly minimizes thermal resistance at the contact junction, accelerating energy movement away from delicate processor dies into the main heatsink assembly.
This carbon-based compound exhibits outstanding structural stability under severe thermal cycling, resisting physical degradation, separation, or structural pump-out. The engineered consistency allows it to maintain an optimal low-clearance bond line when placed under standard mounting bracket pressure, ensuring reliable heat conduction without suffering from early surface dehydration or performance drop-off over time.
Key Features & Specifications
Thermal conductivity: Rated at a high-performance 13.9 W/mK to maintain ultra-fast thermal exchange between performance processor dies and copper or aluminum cooling plates.
Electrical conductivity: Engineered to be entirely non-conductive and non-capacitive, ensuring complete short-circuit safety when operating near exposed surface components or circuit traces.
Viscosity/application ease: Maintains a stable 200,000 cps physical viscosity, supplying a balanced consistency that spreads evenly across a heat spreader without thinning out or bleeding.
Longevity/durability: Features an exceptional high-durability chemical composition designed to remain fully effective for a minimum of 5 years without cracking, drying out, or needing scheduled reapplication.
The Computer Guy Charmhaven Advantage
In-Store Advice: Our local technical professionals provide direct advice on selecting the correct thermal paste quantity and demonstrates standard line, cross, or spread application methods for modern multi-die layouts.
Local Support & Advice: Access dedicated hands-on assistance right here in Charmhaven to help guide you through proper old compound removal, surface preparation, and precise syringe application during your upgrade.
$15.00
Only 1 left in stock
%20Specs.webp)
| Weight | .03 kg |
|---|---|
| Dimensions | 21 × 10 × 2 cm |
Important Product Information
Universal application profiles offer seamless operational support for intensive desktop CPUs, graphics card GPUs, workstation hardware, high-end laptops, and home gaming consoles.
Local technical support offers targeted advice for executing proper application layer thickness to safely prevent excess side run-off while maintaining optimal contact efficiency.
Specifications Table
| Feature | Specification |
| Model Number | BS-139 / X0012AB81P |
| Thermal Conductivity (W/mK) | 13.9 W/mK |
| Electrical Conductivity | Non-Conductive / Non-Capacitive |
| Viscosity | 200,000 cps |
| Operating Temperature Range | -50°C to 220°C |
| Tube Size / Quantity | 3.5 Grams |
| Paste Type | Carbon-based |
| Durability / Lifespan | Minimum 5-year lifespan formula |
| Application Method | Syringe dispenser with included toolkit |
| Included Accessories | Multi-piece application toolkit (wipes, spreader, application stencils) |



