The Thermal Grizzly Minus Pad 8 30x30x0.5mm Thermal Pad [TG-MP8-30-30-05-1R] introduces an ultra-high-performance interface component designed to bridge physical clearance variations between delicate board microchips and primary cooling structures. Engineered specifically to eliminate the microscopic air pockets that limit thermal dissipation, this professional-grade pad delivers an immediate and highly efficient heat transport pipeline across small form-factor devices and high-load silicon components.
This premium cooling solution features an exceptionally elastic, compliant, and flexible surface matrix composed of an advanced ceramic silicone formula blended with premium nano-aluminum oxide. This specialized chemical distribution allows the pad to mold seamlessly to complex component shapes under the lightest contact pressure, filling micro-scale surface imperfections while providing permanent structural durability that resists drying, oil bleeding, or pump-out over extensive high-wattage hardware lifecycles.
Key Features & Specifications
Thermal conductivity: Rated at a consistent 8.0 W/mK to deliver highly efficient, reliable heat transport across dense processing dies and power distribution circuits.
Electrical conductivity: Specially engineered with an absolute 0 pS/m structural profile to maintain total electrical insulation, removing any short-circuit risk when laid directly across exposed pathways.
Viscosity/application ease: Formulated as a highly compressible, pliable solid sheet that is remarkably easy to cut to size with scissors, simplifying installation across varied hardware configurations.
Operating temperature range: Exhibits incredible chemical stability and physical flexibility across an expansive operational spectrum spanning from -100°C all the way up to +250°C.
The Computer Guy Charmhaven Advantage
In-Store Advice: Our local technical specialists offer direct advice on choosing between specialized thermal pads or standard paste formulations and identifying the precise thickness combinations needed for your cooling layout.
Local Support & Advice: Access dedicated, hands-on layout and cutting insights right here in Charmhaven to ensure your custom thermal pad dimensions map perfectly to your hardware components during a full system rebuild.
$10.00
In stock
%20Specs.webp)
| Weight | .1 kg |
|---|---|
| Dimensions | 18 × 14 × 4 cm |
Important Product Information
Compatibility: Universally compatible with desktop graphics card VRAM/VRM cooling plates, solid-state drive (SSD) heatsinks, gaming laptop motherboard modules, and home gaming consoles such as the PS4/PS5 or Xbox Series X.
Local support: Our local store team delivers focused placement assistance, guiding you through proper surface preparation and appropriate pad selections to eliminate insulating air gaps.
Specifications Table
| Feature | Specification |
| Model Number | TG-MP8-30-30-05-1R |
| Thermal Conductivity (W/mK) | 8.0 W/mK |
| Electrical Conductivity | Non-Conductive / Electrically Insulated (0 pS/m) |
| Viscosity | Pliable Solid Sheet (High Compressibility) |
| Operating Temperature Range | -100°C to +250°C |
| Tube Size / Quantity | 1 Pad (30 mm × 30 mm × 0.5 mm) |
| Paste Type | Ceramic silicone-based thermal pad |
| Durability / Lifespan | Non-drying, eco-friendly, RoHS-compliant formula |
| Application Method | Pre-formed pad (Cut-to-size sheet layout) |
| Included Accessories | 1x Minus Pad 8 sheet |
